Hybrid placement carried out alternately for dispensing and component placement processes is achieved due to the mounting head and dispensing head being combined that allows design changes to be fitted on to each axis according to production requirements. This feature surpasses the framework of conventional SMT bringing enhancement for 3D MID processes. S10, S20 Features Enhancement for 3D MID processes are achieved thanks to the newly developed cast iron frame and tilt mechanism unitĬoncave-convex, sloped and curved surface mounting achieving the possibility for the manufacture of new 3D MID (Molded Interconnect Device) are now achievable thanks to a longer stroke on the Z-axis, and Yamaha's original optimal design for its newly developed cast iron frame and tilt mechanism unit. Within the production processes required for control board manufacture, in order to achieve lightweight, compactness and high performance coupled with lower costs, changes are being seen from the conventional two-dimensional placement (flat-surface) to three-dimensional placement, and three-dimensional capability is being further down-sized and adopted in the SMT (surface mounting) fields.īy launching the S10 and S20 with even higher flexibility and productivity in their hybrid capability, we can provide more flexible support for 3D MID (Molded Interconnect Device), which can lead to greater cost-cutting through a reduction in the number of components and man-hours required in assembly work, and will result in smaller and thinner products as well as meeting a wider range of user needs in mounting, as a way to create and expand our own market. In addition to this, increases are also being seen in further low- cost reduction, diversity, and a wider range of applications available. The market expansion in recent years for products that incorporate control boards such as smart phones and tablet devices, electric cars, natural energy power generation, and LED lighting are becoming more highly integrated, lightweight, thinner and smaller. The S20 will be on display at the JISSO PROTEC2015 (17th Jisso Process Technology Exhibition) at the Tokyo Big Sight, Japan (Koto-ku, Tokyo) from June 3-5. In addition, stable dispensing and inspecting is carried out thanks to the adoption of a color fiducial mark recognition camera and newly developed lighting units. Cost performance is further enhanced through improved in placement capability. Head variation can also be set to a 6-axis 6-theta, or 12-axis 2-theta configurations. Through a newly developed tilt mechanism unit and a long stroke on the Z axis in the S10 and S20 models, surface mounting is now possible on concave-convex, sloped and curved surfaces bringing enhanced expandability to suit production types over and above conventional flat board types. The S10 and S20 are more advanced models than the existing M10 and M20 offering improved flexibility, expandability and productivity. In addition to having superior product loading speed and accuracy as well as highly versatile mounting options from ultra-small chips to large components, these models are hybrids with their mounting heads and dispensing heads intermingled allowing alternate dispensing and mounting.

The S10 and S20 have been developed under the concept of a single unit Manufacturing Center designed for surface mounting, dispensing and inspecting. (Tokyo: 7272) announces the release of its new S10 and S20 i-PULSE 3D HYBRID SURFACE MOUNTERS with enhanced support for MID's (Molded Interconnect Devices) from September 1, 2015.

IWATA, May 28, 2015- Yamaha Motor Co., Ltd.

Yamaha ipulse